SEMICS has a culture of supporting our staff as they take on new challenges, regardless of the outcome.
SEMICS provides customized training curricula for our clients who use OPUS to maximize their work efficiency and optimize their use environment. Each curriculum is divided into Basic and Advanced, and the schedule of each course can be customized flexibly according to the clients requests.
Client
Local Training Center (China, Taiwan)
Headquarters in Korea
09:00am - 18:00pm
A class of five persons is optimal for training, but the number can be changed.
Operation
Maintenance
Engineering
| Opeeration | |||
|---|---|---|---|
| Contents | Detail | ||
| Basic | 1 | HW overview | |
| a | Utility | ||
| b | Stage | ||
| c | Loader | ||
| FOUP | |||
| 2 | SW overview | ||
| a | TFC | ||
| b | SW screen summary | ||
| c | SW screen summary | ||
| d | Docking port | ||
| e | Cassette load/unload | ||
| f | device file change | ||
| g | probe card change | ||
| h | needle alignment | ||
| 4 | Start & End production | ||
| a | Start Lot run | ||
| b | probing mode | ||
| c | Pause Lot run | ||
| d | Pause option | ||
| e | Wafer slot selection | ||
| f | End Lot run | ||
| 5 | Wafer handling | ||
| a | Cassette load/unload | ||
| b | Pre aligner | ||
| c | OCR | ||
| d | Drawer | ||
| e | Chuck | ||
| Advanced | 6 | Function | |
| a | Manual needle cleaning | ||
| b | Manual needle inspection | ||
| c | manual PTPA | ||
| d | Probing sequence adjust | ||
| e | Adjust probe mark | ||
| f | Manual PMI | ||
| g | TFC | ||
| h | Manual scan cassette | ||
| 7 | troubleshooting | ||
| a | Error scrren capture | ||
| b | Machine initialize | ||
| c | Utility check | ||
| d | Log file folder tree | ||
| e | Error state check | ||
| f | SW on/off | ||
| g | SW install/uninstall | ||
| Maintenance | |||
|---|---|---|---|
| Contents | Detail | ||
| Basic | 1 | Machine setup - layout | |
| a | Uncrate | ||
| b | Layout | ||
| c | Leveling | ||
| d | Utility | ||
| e | Machine power on/off | ||
| f | Packing/unpacking | ||
| 2 | HW overview | ||
| a | Utility | ||
| b | Stage | ||
| c | SACC | ||
| d | Loader | ||
| e | FOUP | ||
| f | PC | ||
| f | Electrical diagram | ||
| 3 | SW overview | ||
| a | TFC | ||
| b | SW screen summary | ||
| c | Parameter folder structure | ||
| d | |||
| 4 | Preparation for production | ||
| a | Docking port | ||
| b | Cassette load/unload | ||
| c | device file change | ||
| d | probe card change | ||
| e | needle alignment | ||
| 5 | Start & End production | ||
| a | Start Lot run | ||
| b | probing mode | ||
| c | Pause Lot run | ||
| d | Pause option | ||
| e | Wafer slot selection | ||
| f | End Lot run | ||
| 6 | Wafer handling | ||
| a | Cassette load/unload | ||
| b | Pre aligner | ||
| c | OCR | ||
| d | Drawer | ||
| e | Chuck | ||
| f | |||
| 7 | Function (basic) | ||
| a | Manual needle cleaning execution | ||
| b | Manual needle inspection | ||
| c | manual PTPA | ||
| d | Probing sequence adjust | ||
| e | Adjust probe mark | ||
| f | Manual PMI | ||
| g | Manual scan cassette | ||
| h | Chuck temperature control | ||
| 8 | Function (module) | ||
| a | SACC | ||
| b | NC | ||
| c | FOUP | ||
| Advanced | 8 | Utility | |
| a | IOIO | ||
| b | IOIO2 | ||
| c | NET GUI | ||
| d | TFC | ||
| 9 | machine setup - Origin position | ||
| a | Loader org | ||
| b | Pre org | ||
| c | OCR | ||
| d | Fixed tray | ||
| e | Drawer | ||
| f | chuck loading | ||
| g | ARM | ||
| h | Camera | ||
| 10 | Replacement - electrical part | ||
| a | Net IO b/d | ||
| b | IO interface b/d | ||
| c | Light b/d | ||
| d | Mux b/d | ||
| e | Grabber b/d | ||
| f | ZMP b/d | ||
| g | Remote Motion Block (A2S, P2S) | ||
| h | SMPS | ||
| 11 | Replacement - hardware part | ||
| a | Chuck | ||
| b | Wafer camera (base) | ||
| c | Pin camera (base) | ||
| d | Reference Mark | ||
| e | Arm | ||
| PC | |||
| 12 | Planarity check | ||
| a | Chuck | ||
| b | Card holder | ||
| c | NC PAD | ||
| d | ARM | ||
| e | Chuck temperature | ||
| 13 | Accuracy | ||
| a | First contact | ||
| b | Vision mapping | ||
| c | Motion console | ||
| d | Motion scope | ||
| 14 | Troubleshooting | ||
| a | Air, sensor error debugging | ||
| 15 | Accuracy | ||
| a | Monthly | ||
| b | Semi-annual | ||
| c | Annual | ||
| 16 | Demo RUN | ||
| a | Requirements for Demo-Run | ||
| b | Manual SACC control | ||
| c | Card jam error state | ||
| 17 | Machine settup - layout and operation | ||
| a | Huber chiller | ||
| b | SEMICS hinge | ||
| 18 | Change kit | ||
| a | Hot system ↔ Cold system | ||
| b | Normal Wafer ↔ Framed Wafer | ||
| Engineering | |||
|---|---|---|---|
| Contents | Detail | ||
| Basic | 1 | HW overview | |
| a | Utility | ||
| b | Stage | ||
| c | Loader | ||
| e | FOUP | ||
| 2 | SW overview | ||
| a | TFC | ||
| b | SW screen summary | ||
| c | Parameter folder structure | ||
| d | |||
| 3 | Preparation for production | ||
| a | Docking port | ||
| b | Cassette load/unload | ||
| c | device file change | ||
| d | probe card change | ||
| e | needle alignment | ||
| 4 | Start & End production | ||
| a | Start Lot run | ||
| b | probing mode | ||
| c | Pause Lot run | ||
| d | Pause option | ||
| e | Wafer slot selection | ||
| f | End Lot run | ||
| 5 | Wafer handling | ||
| a | Cassette load/unload | ||
| b | Pre aligner | ||
| c | OCR | ||
| d | Drawer | ||
| e | Chuck | ||
| 6 | Function | ||
| a | Manual needle cleaning execution | ||
| b | Manual needle inspection | ||
| c | manual PTPA | ||
| d | Probing sequence adjust | ||
| e | Adjust probe mark | ||
| f | Manual PMI | ||
| g | Manual scan cassette | ||
| 7 | Trobuleshooting | ||
| a | Error scrren capture | ||
| b | Machine initialize | ||
| c | Utility check | ||
| d | Log file folder tree | ||
| e | Error state check | ||
| f | SW on/off | ||
| g | SW install/uninstall | ||
| h | Manual SACC control | ||
| i | Card jam error state | ||
| 8 | Create device | ||
| a | Wafer physical information | ||
| b | Wafer alignment | ||
| c | Index alignment | ||
| d | pad alignment | ||
| e | pin alignmen (card setup) | ||
| Advanced | 9 | Function for Device | |
| a | NC parameter setup | ||
| b | SOAK setup | ||
| c | Z soft-touch setup | ||
| d | Binning | ||
| e | OCR | ||
| f | Sample test | ||
| g | Import map | ||
| h | Retest | ||
| i | PMI | ||
| j | Inking | ||
| k | Map sequence | ||
| l | Make imap file | ||
| 10 | Manual contact | ||
| a | Set overdrive 0 | ||
| b | Check and Adjust probe mark position | ||
| c | Edit dut information | ||
| d | Make probing sequence manually | ||
| 11 | Demo-Run | ||
| a | Requirements for Demo-Run | ||
| 12 | Wafer handling | ||
| a | ewbl wafer | ||
| b | Thin wafer | ||
| 13 | Map | ||
| a | Converter | ||
| b | network setting | ||
| c | format | ||
| 14 | GPIB/GEM | ||
| a | GPIB setting | ||
| b | GPIB driver change | ||
| 15 | GPIB/GEM | ||
| a | Z origin | ||
| b | Probing clearance | ||
| c | First contact | ||
| d | Over drive | ||
| e | NC offset | ||
| f | Wafer thickness | ||
732-37 Gyeongchung-daero, Gonjiam-eup, Gwangju-si, Gyeonggi-do, Republic of Korea
TEL 031-697-6600 Fax : 031-798-3234
Copyright © 2019 SEMICS INC All Rright Reserved.
