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STANDARD MODEL

OPUS3 SE

OPUS3 SE is specialized in 6 & 8 inch wafer handling and it is optimized to compact foot print.
It is compact, with high accuracy for consistent contact/probing and fast index time for higher throughput.

  • OPUS3 SE
Key features Overview
  • Specialized in 6 & 8 inch wafer
  • Space efficient foot print
  • Reliable temperature control
  • Stiff and strong Z structure
  • Map shift prevention
  • Real-time recipe validation
  • Intelligent pin alignment algorithm
  • Smart probing route algorithm
Specification Overview
Name OPUS3 SE
Wafer Size 6 & 8 inch
X, Y Probing Area X : ±115mm
Y : ±115mm
Max Probing Force 230kgf
XY Accuracy X : ±1.5㎛
Y : ±1.5㎛
Tri-Temp COLD: -40℃ / -55℃
HOT: 150℃ / 200℃
AMBIENT CONTROL (25℃)
Product list
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